Indian Company Master Data Made Simple

High Network Infra Buildcon Private Limited

Profile data last updated: 19/12/2024

The company, High Network Infra Buildcon Private Limited, was incorporated on 20 Jul 2022 and is now 3 years old. High Network Infra Buildcon Private Limited holds the CIN U45309TN2022PTC154053 and registration number 154053. The organization is recorded as company limited by shares under Indian company law. Authorized share capital stands at ₹15.00 lakh. Paid-up capital currently stands at ₹1.00 lakh.

Its principal business sector is building installation [ these activities are usually performed at the site of construction, although parts of the job may be carried out in a special shop. repair of installations are also in. It operates under Chennai’s corporate registry. The firm’s incorporation address reads No.6 Padmanabha Nagar 2nd Street Adyar, Chennai, Chennai, Tamil Nadu, India, 600020. It is an active company at present. The company’s official contact email is seniorfinance@bhoomiandbuildings.com.

Company Overview

CIN
U45309TN2022PTC154053
Date of Incorporation
20/07/2022
Company Status
Active
RoC
Chennai
Registration Number
154053
Balance sheet date
31/03/2024
Company Category
Company limited by shares
Company Sub Category
Non-government company
Listed in Stock Exchange
No
Class of Company
Private Limited Company
LEI Number
-
Authorized Capital
₹15,00,000.00
Paid up Capital
₹1,00,000.00
Activity
Building installation [ These activities are usually performed at the site of construction, although parts of the job may be carried out in a special shop. Repair of installations are also in
E-mail
seniorfinance@bhoomiandbuildings.com
PAN
-

Directors

AppointmentDirector nameDINDesignation
20/07/2022Nagendaran Sathya Sai Sankar07606061DirectorView other directorships
20/07/2022Arumugam Sundar00529475DirectorView other directorships

Latest Documents

Category:
DateTitleSize
11/11/2024
Form AOC-4-09112024
 -
10/11/2024
Form MGT-7A-09112024
 -
03/05/2024
Form AOC-4-03052024_signed
 -
02/05/2024
Form MGT-7A-02052024
 -

Similar Companies

CompanyCINAddress
Chiranjeeva Housing Private LimitedU45300AP2007PTC0550945-44, Poleramma Temple Street Ganapavaram, Nadendla Mandal, Guntur, Guntur, Andhra Pradesh, India, 522619
Dvr Infratech Private LimitedU45300AP2008PTC057680504, Venkatadurga Residency Duvvada Railway Station Road, Kurmannapa, Lem, Visakhapatnam, Andhra Pradesh, India, 530046
Jeevan Jyothi Rural Development & Reconstruction Private LimitedU45300AP2008PTC059183Venkat Enclave,tikkal Road, Flat No.gf3, Vijayawada Srikakulam Ap 520010 In
Vijayraja Heights Private LimitedU45300AP2008PTC05906247-9-1/14; Flat No.402; Vinayagar Annapurna; Iii Lane; Dwarakanagar; Visakhapatnam; Andhra Pradesh; 530016; India
Yuktha Sai Home Needs Private LimitedU45300AP1982PTC0035935/927, M.g. Street Srikalahasti Cuddapah Ap 517644 In
More similar companies

Address

No.6 Padmanabha Nagar 2nd Street Adyar, Chennai, Chennai, Tamil Nadu, India, 600020

Frequently Asked Questions

What is the incorporation date of High Network Infra Buildcon Private Limited?
The incorporation date of High Network Infra Buildcon Private Limited is 20/07/2022.
What is the authorized share capital and paid-up capital of High Network Infra Buildcon Private Limited?
The authorized share capital of High Network Infra Buildcon Private Limited is ₹15,00,000.00. The paid-up capital is ₹1,00,000.00.
Who are the current board members & directors of High Network Infra Buildcon Private Limited?

The current board member of High Network Infra Buildcon Private Limited are:

  • Nagendaran Sathya Sai Sankar
  • Arumugam Sundar
What is the registered address of High Network Infra Buildcon Private Limited?
The registered address of High Network Infra Buildcon Private Limited is No.6 Padmanabha Nagar 2nd Street Adyar, Chennai, Chennai, Tamil Nadu, India, 600020.
What is the Corporate Identification Number of High Network Infra Buildcon Private Limited?
The Corporate Identification Number of High Network Infra Buildcon Private Limited is U45309TN2022PTC154053.